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NCT1008
http://onsemi.com
2
Figure 1. Functional Block Diagram
ON-CHIP
TEMPERATURE
SENSOR
ANALOG
MUX
BUSY
A-TO-D
CONVERTER
LOCAL TEMPERATURE
VALUE REGISTER
REMOTE OFFSET
REGISTER
RUN/STANDBY
EXTERNAL DIODE OPEN-CIRCUIT
STATUS REGISTERS
SMBus/I
2
C INTERFACE
INTERRUPT
MASKING
SDATA
SCLK
8
7
ADDRESS POINTER
REGISTER
CONVERSION RATE
REGISTER
LOCAL TEMPERATURE
LOW-LIMIT REGISTER
LOCAL TEMPERATURE
HIGH-LIMIT REGISTER
REMOTE TEMPERATURE
LOW-LIMIT REGISTER
REMOTE TEMPERATURE
HIGH-LIMIT REGISTER
LOCAL THERM
LIMIT REGISTERS
EXTERNAL THERM
LIMIT REGISTERS
CONFIGURATION
REGISTERS
4
6
GND
5
V
DD
1
NCT1008
D+
ALERT
/THERM2
THERM
2
D
3
REMOTE TEMPERATURE
VALUE REGISTER
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
Positive Supply Voltage (V
DD
) to GND
0.3, +3.6
V
D+
0.3 to V
DD
 + 0.3
V
D to GND
0.3 to +0.6
V
SCLK, SDATA, ALERT
, THERM
0.3 to +3.6
V
Input Current, SDATA, THERM
1, +50
mA
Input Current, D
?
mA
ESD Rating, All Pins (Human Body Model)
1,500
V
Maximum Junction Temperature (T
J
 
MAX
)
150
癈
Storage Temperature Range
65 to +150
癈
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE:   This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS (Note 1)
Package Type
q
JA
q
JC
Unit
8-lead DFN
142
43.74
癈/W
1.  q
JA
 is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
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